KIOXIA Unveils 8 TB Flash Memory Using 2 mm Assembly Technology Add to favorites
Last update time : 2025-09-26 13:46:47
KIOXIA has announced a new 8 TB flash memory module by stacking 32 units of 2 Tb dies into a package under 2 mm in height. This advancement marks a significant milestone for high-capacity storage in AI and data center applications.
Using a new “2 mm Flash Memory Assembly Technology,” KIOXIA stacked 32 units of 2 Tb dies into a single package to achieve 8 TB capacity.
The design keeps the package height below 2 mm, which is a major advantage for high-density storage solutions.
The process involves ultra-thin wafer grinding, specialized material design, and extremely precise wire bonding to enable the stacking and integration without compromising reliability.
This innovation is particularly relevant for AI workloads, which demand large, fast memory systems, as well as for data centers seeking better energy efficiency and storage density.
KIOXIA also indicated it plans to further explore higher stacking counts and advanced packaging technologies in future generations.
Tags : KIOXIA 2 mm assembly technology flash memory 8 TB capacity data storage packaging process AI workloads
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